CPiS 2021

Column:Company News Time:2021-11-01

The 12th China Package Technology Innovation and Sustainable Development Forum(CPiS 2021) ended successfully at the InterContinental Hefei.

Been invited to participate,Brotech displayed its popular model CDF330 digital label finishing system (with automatic slitting system), shrink sleeve label seaming system and digital die-cutting system.

During the three-day exhibition, our booth attracted countless exhibitors and opened new market opportunities.